SIPI

Fundamentals / 04

Transmission-Line Reflections and Ringing

A signal that meets a change in impedance sends part of itself back the way it came. On a line that isn't terminated, that echo bounces between the driver and the load — again and again — until the losses finally kill it.

Best viewed on a laptop or desktop. These panels are built so you can move a slider and watch several charts answer at once. A phone has no room to put them side by side.

1 V step into a 3-inch stripline · Td = 500 ps analytical Γs ΓL launched overshoot
Voltage along the line — watch the wave travel and bounce
total voltage forward wave reflected wave
Voltage vs time — drag to scrub
at load at driver settled value
Bounce diagram — position across, time down
travelling to the load travelling back
10 Ω
Output impedance of the buffer
50 Ω
Set by stackup and trace geometry
∞ (open)
80 ps
Slow it past 2Td = 1000 ps and the ringing hides
edge launched · t = 0

What you see on the scope

Before the physics, the symptom. You probe a net at the receiver and expect to see a clean 0-to-1 V step. Instead the waveform overshoots to 1.6 V, dips back to 0.7 V, bounces up again, and after a few cycles settles to the 1 V it was supposed to reach. That staircase is ringing, and it is the single most recognisable waveform defect in digital board design.

Ringing is not random noise. It is a signal bouncing back and forth between the two ends of a trace, like a ball between two walls. Each bounce is smaller than the last — the driver absorbs some of the energy on every return trip — but the first overshoot can be large enough to damage an input, trip an ESD clamp, or violate a timing spec. The rest of this page explains why it happens and how to predict its amplitude.

What is actually happening

Here is the thing that makes reflections click: the driver has no idea what is at the far end of the line. When the buffer switches, the edge starts travelling down the trace at roughly half the speed of light, and it will not reach the load for another 500 picoseconds. It has to decide how much voltage to launch right now, with no information about the load whatsoever.

So it does the only thing it can. It sees the line's characteristic impedance — 50 Ω, in the panel above — and treats it as if it were a 50 Ω resistor to ground. A 10 Ω driver into a 50 Ω line is just a voltage divider: it launches about 833 mV of the 1 V swing, and that packet of voltage sets off down the trace.

Half a nanosecond later it arrives at the load and finds an open circuit — a CMOS input pin is, to a first approximation, no load at all. Now there is a contradiction. The wave is carrying 833 mV and 16.7 mA of current, but an open circuit cannot accept any current. The only way to satisfy both the line and the load is to launch a second wave back toward the driver, one that exactly cancels the incoming current — and that reflected wave carries another 833 mV with it. Which is why the voltage at the load momentarily jumps to 1.67 V, well above the rail it was supposed to reach.

That echo now travels back, and 500 ps later it reaches the driver — which is a 10 Ω source, also not a match for 50 Ω. So it reflects again, this time mostly inverted, and heads back to the load. Each round trip the amplitude shrinks by the product of the two reflection coefficients, and the voltage staircases its way toward the value it should have had all along. Drag the scrubber on the middle panel and you can watch each step land, one every 2Td.

The part that costs you silicon Compare the 1.67 V overshoot with the receiver's specified AC limit and allowed duration. Repeated excursions outside that envelope can affect reliability, while an undershoot or secondary crossing can consume noise margin or create an unintended transition.

Three ways to control reflections

Every termination scheme is the same idea wearing different clothes: make one end of the line look like the line. Kill either reflection coefficient and the echo has nowhere to go.

Use the impedances at the physical endpoints For a source termination, include the driver's output impedance, package, and added resistor; their sum is what the returning wave sees. For a parallel termination, include the receiver input and the connection between the resistor and pad. A resistor with the right printed value can still be the wrong termination when a via or stub separates it from the endpoint.
Go deeper — the maths, the numbers, and where the rules of thumb break

Everything above falls out of one equation. At any interface between an impedance Z2 and the line it sits on, the fraction of the incident wave that comes back is:

Γ = ( Z2Z0 ) / ( Z2 + Z0 ) Γ = +1 at an open (Z₂ → ∞), −1 at a short (Z₂ = 0), and exactly 0 when Z₂ = Z₀. Γ is bounded by ±1 for any passive load.

And the amount the driver launches in the first place is a plain resistive divider against the line, not against the load:

Vinc = Vs · Z0 / ( Rs + Z0 ) With Vs = 1 V, Rs = 10 Ω, Z₀ = 50 Ω: 833 mV. The load never enters this expression.

The voltage sitting at the load right after the first reflection is the incident wave plus its own echo, which is where the 1.67 V comes from:

Vload(Td) = Vinc · ( 1 + ΓL ) = 833 mV × 2 = 1.67 V Every subsequent step is smaller by a factor of ΓL·Γs, arriving one round trip (2Td) apart.

When does this matter?

The industry rule of thumb is that reflections become a problem when the round-trip delay is a meaningful fraction of the rise time — commonly stated as:

terminate when   2Td > tr / 3 Equivalently: a trace becomes "long" past roughly t_r / (6 · propagation delay per unit length).

Where that rule is insufficient. It assumes a single driver, a single receiver, and a uniform line. Extend the analysis for:

  • Multi-drop nets. Every stub is another discontinuity with its own Γ. The round-trip rule alone does not describe a resonant T-branch.
  • Loads that aren't resistive. A real CMOS input is a few pF, not an open. The reflection coefficient becomes frequency-dependent, and the sharp corners in the panel above become rounded in silicon.
  • Long lossy channels. Past a couple of GHz the line attenuates the echo faster than the reflection coefficients do. Above ~10 dB of insertion loss the reflections mostly bury themselves — but by then loss and ISI are your problem instead.

The three schemes, side by side

SchemeΓ killedDC powerSignal at loadTypical use
Series (source)Γs → 0nonefull swing, one stepreset, control, slow GPIO
Parallel to groundΓL → 0V²/Z₀ when highset by the source/load divider, not by the terminationrarely alone
Thevenin (split)ΓL → 0continuousfull swing, biasedlegacy DDR address/command
On-die (ODT)ΓL → 0gated per burstfull swingLPDDR5X, PCIe, USB, UFS

Modern high-speed interfaces have almost entirely moved the termination on-die, which is worth understanding as an SI decision and not just a packaging one: a resistor on the board sits a via and a stub away from the actual receiver, and at 8533 MT/s that parasitic inductance is enough to undo most of what the termination was supposed to buy you. Putting it inside the pad removes the stub — and lets the controller switch it on only during a read burst, which is the only reason the power budget survives.

In the real world

Reflections are a useful early hypothesis when a net misbehaves, and source damping is often inexpensive. They can also be designed in and then discovered at bring-up, because a schematic gives you no hint that a trace is electrically long. Fast data buses usually receive careful transmission-line analysis, while a reset line routed 8 inches across the board to four loads may receive less attention. With an uncharacterised buffer, that line can arrive with 400 mV of ringing near the receiver's threshold.

The practical sign-off habit: before worrying about eye diagrams, sweep the driver corner. A fast- strong process corner has a lower Rs and a faster tr than the typical model — both of which make reflections worse. A net that passes at typical and fails at fast-strong is the classic reflection signature, and you can spot it in the panel above by dragging Rs down and tr left at the same time.

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